Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC33FS6500CAESYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc. |
250 |
|
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- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MPF5024CMBA0ESPOWER MANAGEMENT IC, PRE-PROG, 4 NXP USA Inc. |
490 |
|
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- | 40-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MC33FS4500LAESYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
250 |
|
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- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MC33FS4505CAESYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
240 |
|
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- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6500LAESYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc. |
250 |
|
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- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6505CAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
250 |
|
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- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC35FS6505NAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
250 |
|
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- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS4505LAESYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
250 |
|
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- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6510LAESYSTEM BASIS CHIP DCDC 1.5A VCO NXP USA Inc. |
250 |
|
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- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MC33PF3000A0ESPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
260 |
|
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- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) |