Microchip Technology AX500-CQ208M

Part No.:
AX500-CQ208M
Manufacturer:
Microchip Technology
Category:
FPGAs (Field Programmable Gate Array)
Package:
208-BFCQFP with Tie Bar
Datasheet:
IC-MAX.COMAX500-CQ208M.pdf
Description:
IC FPGA 115 I/O 208CQFP
Quantity:

Unit Price:$0

Ext Price:$0

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AX500-CQ208M Information

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Attribute value
Manufacturer:
Microchip Technology
Series:
Axcelerator
Package/Case:
208-BFCQFP with Tie Bar
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
-
Total RAM Bits:
73728
Number of I/O:
115
Number of Gates:
500000
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Supplier Device Package:
208-CQFP (75x75)
Datasheet:
IC-MAX.COMAX500-CQ208M.pdf
Image AX500-1PQG208 AX500-2PQG208 AX500-1FG484 AX500-FG484I AX500-2FG484
Part Number AX500-1PQG208 AX500-2PQG208 AX500-1FG484 AX500-FG484I AX500-2FG484
Manufacturer Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Series Axcelerator Axcelerator Axcelerator Axcelerator Axcelerator
Package/Case 208-BFQFP 208-BFQFP 484-BGA 484-BGA 484-BGA
Packaging Tray Tray Tray Tray Tray
Product Status Active Active Active Active Active
Programmable Not Verified Not Verified Not Verified Not Verified Not Verified
Number of LABs/CLBs 8064 8064 8064 8064 8064
Number of Logic Elements/Cells - - - - -
Total RAM Bits 73728 73728 73728 73728 73728
Number of I/O 115 115 317 317 317
Number of Gates 500000 500000 500000 500000 500000
Voltage - Supply 1.425V ~ 1.575V 1.425V ~ 1.575V 1.425V ~ 1.575V 1.425V ~ 1.575V 1.425V ~ 1.575V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature 0°C ~ 70°C (TA) 0°C ~ 70°C (TA) 0°C ~ 70°C (TA) -40°C ~ 85°C (TA) 0°C ~ 70°C (TA)
Grade - - - - -
Qualification - - - - -
Supplier Device Package 208-PQFP (28x28) 208-PQFP (28x28) 484-FPBGA (23x23) 484-FPBGA (23x23) 484-FPBGA (23x23)
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Step1:Prepare product
Step1:Prepare product
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Step2:Vacuum packaging
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Step4:Individual package
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