Alliance Memory, Inc. ASFC10G31P3-51BIN

Part No.:
ASFC10G31P3-51BIN
Manufacturer:
Alliance Memory, Inc.
Category:
Memory
Package:
153-TFBGA
Datasheet:
IC-MAX.COMASFC10G31P3-51BIN.pdf
Description:
10GB, PSLC EMMC 5.1, 3V, GEN3 TL
Quantity:

Unit Price:$0

Ext Price:$0

Payment:
Payment
Shipping:
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ASFC10G31P3-51BIN Information

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Manufacturer:
Alliance Memory, Inc.
Series:
-
Package/Case:
153-TFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
-
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND (pSLC)
Memory Size:
80Gbit
Memory Organization:
10G x 8
Memory Interface:
eMMC_5.1
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
153-FBGA (11.5x13)
Datasheet:
IC-MAX.COMASFC10G31P3-51BIN.pdf
Image ASFC10G31P3-51BIN ASFC10G31P3-51BINTR
Part Number ASFC10G31P3-51BIN ASFC10G31P3-51BINTR
Manufacturer Alliance Memory, Inc. Alliance Memory, Inc.
Series - -
Package/Case 153-TFBGA 153-TFBGA
Packaging Tray Tape & Reel (TR)
Product Status Active Active
Programmable - -
Memory Type Non-Volatile Non-Volatile
Memory Format FLASH FLASH
Technology FLASH - NAND (pSLC) FLASH - NAND (pSLC)
Memory Size 80Gbit 80Gbit
Memory Organization 10G x 8 10G x 8
Memory Interface eMMC_5.1 eMMC_5.1
Clock Frequency 200 MHz 200 MHz
Write Cycle Time - Word, Page - -
Access Time - -
Voltage - Supply 2.7V ~ 3.6V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TC) -40°C ~ 85°C (TC)
Grade - -
Qualification - -
Mounting Type Surface Mount Surface Mount
Supplier Device Package 153-FBGA (11.5x13) 153-FBGA (11.5x13)
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Step1:Prepare product
Step1:Prepare product
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Step2:Vacuum packaging
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Step4:Individual package
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