STMicroelectronics STM32F100C6T6B

Part No.:
STM32F100C6T6B
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
IC-MAX.COMSTM32F100C6T6B.pdf
Description:
IC MCU 32BIT 32KB FLASH 48LQFP
Quantity:

Unit Price:$0

Ext Price:$0

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STM32F100C6T6B Information

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Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
48-LQFP
Series:
STM32F1
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
24MHz
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number of I/O:
37
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
Datasheet:
IC-MAX.COMSTM32F100C6T6B.pdf
Image STM32F100C6T6B STM32F100C6T6BTR
Part Number STM32F100C6T6B STM32F100C6T6BTR
Manufacturer STMicroelectronics STMicroelectronics
Package/Case 48-LQFP 48-LQFP
Series STM32F1 STM32F1
Packaging Tray Tape & Reel (TR)
Product Status Active Active
Programmable Not Verified Not Verified
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 24MHz 24MHz
Connectivity I2C, IrDA, LINbus, SPI, UART/USART I2C, IrDA, LINbus, SPI, UART/USART
Peripherals DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number of I/O 37 37
Program Memory Size 32KB (32K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 4K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 2V ~ 3.6V 2V ~ 3.6V
Data Converters A/D 10x12b; D/A 2x12b A/D 10x12b; D/A 2x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Grade - -
Qualification - -
Mounting Type Surface Mount Surface Mount
Supplier Device Package
  • STM32F100C6T6B
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Step1:Prepare product
Step1:Prepare product
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Step2:Vacuum packaging
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Step4:Individual package
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